Abstract: 3D integration photonic interposer is becoming popular in the field of co-packaging optics (CPO). In this paper, we integrate the edge coupler and through silicon via (TSV) into the silicon ...
slmsuite combines GPU-accelerated beamforming algorithms with optimized hardware control, automated calibration, and user-friendly scripting to enable high-performance programmable optics with modern ...
Abstract: In this paper, a novel 3D power module structure based on direct dielectric liquid cooling is proposed for high voltage applications. This structure allows modular assembly and puts an end ...
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