Semiconductor Engineering

Powering AI At Scale: Why 3D-ICs Demand A New Approach To Power Integrity

Connectivity density and power delivery complexity have made power integrity one of the most critical constraints in modern system design.
IEEE

Vertical-Comb-Driven Tip-Tilt 32×32 Micromirror Array Based on Double-SOI and Single-Crystalline-Silicon TSV

Abstract: Aimed at increasing the yield rate of large-scale vertical-comb-driven tilt-tip (TT) micromirror array (MMA), this paper, for the first time, introduces double-SOI (D-SOI) and our previously ...
KIDY

“Where’s Waldo” operation nets multiple felony arrests in Nolan County

NOLAN COUNTY, Texas — A multiagency law enforcement operation known as “Where’s Waldo” led to multiple felony arrests across Nolan County on Friday, April 10, 2026, according to authorities. The Nolan ...
IEEE

High-Power-Compatible Thick Silicon-on-Insulator Waveguide: An Implementation in Optical Phased Array

Abstract: High-power transmission capability is a critical yet insufficiently explored frontier in integrated photonics. Owing to the restricted optical cross-sectional area of the 220 nm-thick ...