Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

SK Hynix said on Wednesday that it plans to invest the equivalent of US$12.85-billion (R212-billion) in a new manufacturing ...

Reports revenues of 52.5763 trillion won, operating profit of 37.6103 trillion won, net profit of 40.3459 trillion won Record-high quarterly performance driven by increased sales of high value-added ...

SK hynix has started mass production of its 192GB SOCAMM2 memory module, targeting AI server deployments built around the ...

DRAM main memory and flash memory prices are going nuts as the hyperscalers, cloud builders, and AI model builders are trying ...

SK hynix continues development of next-generation DRAM and AI memory solutions, targeting improved efficiency and performance ...

SK hynix has started mass-producing SOCAMM2, a next-gen memory module for AI servers. Optimized for Nvidia's Vera Rubin ...

SK Hynix has accelerated competition in the server memory market by beginning mass production of SOCAMM2, a next-generation ...

The South Korean chipmaker commenced commercial manufacturing of its high-capacity SOCAMM2 modules designed for artificial intelligence computing infrastructure.

SK hynix Inc. (or "the company", announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10 ...

DRAM layout secrecy contributes to the problem, but there’s no indication that it will change. “We argue that keeping ...

Abstract: Edge die yield is becoming critical as semiconductor manufacturing fabs attempt to save costs and reduce wafer edge exclusion to produce more good die per wafer. As a consequence, wafer edge ...