Abstract: To leverage the outstanding high-temperature resistance of silicon carbide (SiC), theoretically up to 500 °C, conventional packaging materials, and structures have become inadequate to meet ...

Abstract: Electromagnetic interference (EMI) from high-speed digital subsystems in laptops can couple into wireless front ends, particularly at 2.4 GHz, degrading link reliability and throughput. This ...

The new series is designed for mobile platforms and mission‑critical deployments across industrial automation, transport, medical technology and robotics, where systems must withstand movement, ...