Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...
Abstract: This article proposes a computational fluid dynamics (CFD)-based machine learning (ML) model to set the temperature of a convection reflow oven and control conveyor speed. Due to the thermal ...
We are at a critical time and supporting science journalism is more important than ever. Science News and our parent organization, the Society for Science, need your help to strengthen scientific ...
Abstract: Reliable detection of defects in electronic components, such as thermistor solder joints and printed circuit board (PCB) surfaces, is critical for ensuring the reliability of spacecraft and ...
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