US-based 3D Glass Solutions (3DGS), through its wholly owned Indian subsidiary Heterogenous Integration Packaging Solutions Pvt Ltd (HIPSPL), is implementing a greenfield, vertically integrated ...

India's first advanced 3D glass chip packaging unit to be set up in Bhubaneswar with Rs 1,943 crore investment, boosting ...

Issued on behalf of VisionWave Holdings, Inc., Starfighters Space, Inc., Avaí Bio, Inc., Lake Victoria Gold Ltd., and QSE – Quantum Secure ...

Completing Task 4 of the U.S. Navy’s 10-MW Advanced Circuit Breaker Development Program, Menlo Micro has demonstrated the ...

This growth trajectory for the antenna market signifies the technology is an essential component of nearly all current ...

The second edition of Inc42's Manufacturing Startups to Watch comprises names like Anmaya Technologies, Bacancy Systems, Maraal Aerospace, Pace Robotics, and Silizium Circuits.

Detailed price information for Visionwave Holdings Inc (VWAV-Q) from The Globe and Mail including charting and trades.

Strategic investment strengthens VisionWave's position in AI-driven sensing, robotics and defense applications.

US-based 3D Glass Solutions, via its Indian subsidiary, is building a greenfield advanced packaging facility in Odisha with a ...

The strategic equity investment reflects a multiple of three times of Foresight’s current market value to reach a post investment valuation of ...

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D Glass Solutions Inc.'s (3DGS) advanced chip ...

Odisha breaks ground on 3D Glass Solutions advanced glass chip packaging unit; State eyes top-tier semiconductor hub status ...