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2.5D IC Micro-Bump Materials Characterization and IMCs Evolution Under Reliability Stress Conditions
Abstract: High density I/O (Input/Output) with close proximity communication between dies in 2.5D heterogeneous integration of disparate ICs (Integrated Circuits) requires substantially miniaturized ...
Abstract: Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction ...
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