For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...
3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...
In this webinar, we will introduce performing spacecraft thermal analysis in the COMSOL Multiphysics® software. The presentation will include a demonstration of how to compute the solar, albedo and ...
Before putting the service into use, the first step is to add files to your OneDrive. The simplest way to do this from your PC is to download OneDrive and drag the files into the OneDrive folder. When ...
Abstract: A parallel multiphysics simulation solver is developed to solve electromagnetic-thermal-mechanical coupling for some challenging large-scale antenna arrays. To achieve high scalability of ...
Abstract: This article presents an accuracy-preserving unified multiphysics domain decomposition framework for electromagneto-thermo-mechanical analysis, which is based on the dual–primal ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results