For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

Researchers have developed a detailed three-dimensional electro-thermo-mechanical model to identify and quantify the swelling force generated by lithium-ion batteries during charging, offering a new ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...

AI-powered physics simulations are speeding up design cycles, cutting costs, and enabling more creative engineering solutions. By combining traditional multiphysics modeling with machine learning, ...

Abstract: In the process of multiphysics coupling computations under frequency-domain electromagnetic (EM) field excitation, it is very challenging to solve a sequence of slowly varying EM linear ...

Our research group is concerned with two lines of investigation: the construction and study of (new) cohomology theories for algebraic varieties and the study of various aspects of the Langlands ...

Abstract: This article presents an accuracy-preserving unified multiphysics domain decomposition framework for electromagneto-thermo-mechanical analysis, which is based on the dual–primal ...