The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Test-flow partitioning between wafer sort and final package test can have a dramatic impact on the cost of test. In some cases, the migration of package tests can be done over time, but the test ...

The emergence of 3-D ICs presents test challenges that extend from design-for-test tools from design-automation companies to device handlers from equipment firms including Advantest and Multitest. A ...

Motorola Inc.’s semiconductor products sector (SPS) today said it has developed and qualified the first wafer level burn-in and test (WLBT) process for flip-chip microprocessors. Motorola aims to ...

ICsense, a TDK Group company, has opened a new Electronic Wafer Sort (EWS) cleanroom as part of its latest strategic investment programme. ICsense has not only ramped up its in-house production ...

The new facility forms part of ICsense’s latest strategic investment programme and is intended to support growing demand for custom ASIC solutions across multiple industries. The global ASIC market is ...

FREMONT, Calif., March 21, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received over $2 ...

FREMONT, Calif., May 19, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received over $2 ...