Wide variation in the way clinical services are provided to similar patients for similar visit types results in highly variable costs but similar clinical outcomes. Objective: To identify optimal ...

Process integration engineers are gradually losing their battle to keep process variations hidden behind the defensive barrier of tight design rules. Variations in metal line widths, layer thicknesses ...

As technology nodes shrink to 90 nanometers and below, chips become much more difficult to manufacture. In-die process variations increase substantially at 90 nm — even more at 65 nm. If these effects ...

As DRAM technologies scale to increasingly tighter pitches, the patterning requirements exceed the limits of conventional ...

Chipmakers are pushing into sub-threshold operation in an effort to prolong battery life and reduce energy costs, adding a whole new set of challenges for design teams. While process and environmental ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...