ScienceAlert on MSN

New '3D' computer chips could extend Moore's Law, study shows

Putting the silicon membranes on the receiving wafer. (University of Illinois Urbana-Champaign) In recent years, computer ...
Science Daily

New 3D silicon chip breakthrough could extend Moore’s Law for years

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...
Hosted on MSN

This new 3D chip could smash AI’s biggest bottleneck

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
Interesting Engineering on MSN

Monolithic 3D silicon chips achieve near-perfect yields at low temperatures

Researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance ...
Tech Xplore

Ultra-thin MoS₂ computer packs 1,400 transistors onto one chip

The rapid advancement and diffusion of artificial intelligence (AI) systems, such as the machine learning models underpinning ...
SiliconANGLE

D-Matrix reveals plan to break through AI’s ‘memory wall’ with 3D DRAM-based chip architecture

Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Knowridge Science Report

This tabletop printer could change how computer chips are made

A new tabletop-sized device developed by engineers at the University of Texas at Austin could dramatically speed up ...